Galvanized and nickel-plated are both anti-corrosion, but nickel-plated is more beautiful and wear-resistant than galvanized, but the cost of nickel-plating is higher
What is the difference between galvanized, nickel-plated and chrome-plated, and what are the benefits of each
1: Nickel plating and chrome plating are both metal surfaces.
2: Nickel-plated, zinc-plated, chrome-plated areas are:
a: Chromium plating is mainly to improve surface hardness, appearance and rust prevention. Chromium plating has good chemical stability, and it does not act in alkali, sulfide, nitric acid and most organic acids, but it can dissolve in hydrohalic acid (such as hydrochloric acid) and hot sulfuric acid. Because chrome does not change color, it can maintain its reflective ability for a long time when used, which is better than silver and nickel. The process is generally electroplating.
b: Nickel plating is wear-resistant, anti-corrosion, anti-rust, generally thinner, and the process is divided into two types: electroplating and chemical.
c: Galvanizing is mainly for aesthetics and anti-rust. Zn is an active metal that can react with acid, so it has poor corrosion resistance and is the cheapest of the three.
What are the benefits of copper bottoming when nickel plating
Copper is directly plated, and nickel plating is better. First, the base is first plated and then gold plated, which saves money and is convenient for processing. .
It is Ni (Sn-Ni compound) that forms an intermetallic compound with the solder during soldering, and the Au layer is only used to protect the Ni layer. However, for many other copper terminals, the surface treatment is Ni-based, and the surface is gold-plated. Others such as Sn and Sn-Pb are also Ni-plated before gold-plating. The main functions are:
1) To increase wear resistance, direct gold plating or gold plating on copper bottom is not as effective as nickel bottom plating
2) Increase the gloss of gold after gold plating, and the coloring of gold plating on copper bottom will be very dark.
The purpose of nickel plating:
The nickel layer is mainly used as a barrier layer between the copper layer and the gold layer to prevent the mutual diffusion of gold and copper, which affects the solderability and service life of the product; at the same time, the nickel layer also greatly increases the mechanical strength of the gold layer
Chromium plating with copper bottom has good salt spray effect, is not easy to rust, and the surface is not easy to oxidize. Compared with nickel bottom, it looks fuller and has better gloss. The nickel plating layer is porous and prone to micro-point corrosion, and the protected substrate can be completely isolated with copper as a primer. The adhesion of metal copper is very strong! Using it as a substrate for electroplating can enhance the adhesion stability of the electrical surface.
Nickel has poor compatibility with some other metals, but copper has good compatibility with many metal materials. We use this characteristic to make copper form a medium between the substrate (including metals and non-metals) and the metal to be plated, so that the plated metal can be better combined. In addition, if the flatness of the substrate surface is not good, it can also be plated with a layer of copper, which can play a smooth role. When plating a certain metal on the target substrate, in order to increase the performance and the feasibility of the process, a layer of copper is first plated on the substrate, and then the final material, such as chromium, nickel, etc., is plated on the copper layer.
What are the benefits of copper bottoming when nickel plating?
Gold plating on copper connections is not easy, but nickel plating is better. It is better to print first and then gold-plate, which saves money and is convenient for labor. .
As far as I know, it is Ni (Sn-Ni compound) that forms an intermetallic compound with the solder during soldering, and the Au layer is only used to protect the Ni layer. However, for many other copper terminals, the surface treatment is Ni-based, and the surface is gold-plated. Others such as Sn and Sn-Pb are also Ni-plated before gold-plating. The main functions are:
1) To increase wear resistance, direct gold plating or gold plating on copper bottom is not as effective as nickel bottom plating
2) Increase the gloss of gold after gold plating, and the coloring of gold plating on copper bottom will be very dark.
The purpose of nickel plating:
The nickel layer is mainly used as a barrier layer between the copper layer and the gold layer to prevent the mutual diffusion of gold and copper, which affects the solderability and service life of the product; at the same time, the nickel layer also greatly increases the mechanical strength of the gold layer
Chromium plating with copper bottom has good salt spray effect, is not easy to rust, and the surface is not easy to oxidize. Compared with nickel bottom, it looks fuller and has better gloss. The nickel plating layer is porous and prone to micro-point corrosion, and the protected substrate can be completely isolated with copper as a primer. The adhesion of metal copper is very strong! Using it as a substrate for electroplating can enhance the adhesion stability of the electrical surface.
Nickel has poor compatibility with some other metals, but copper has good compatibility with many metal materials. We use this characteristic to make copper form a medium between the substrate (including metals and non-metals) and the metal to be plated, so that the plated metal can be better combined. In addition, if the flatness of the substrate surface is not good, it can also be plated with a layer of copper, which can play a smooth role. When plating a certain metal on the target substrate, in order to increase the performance and the feasibility of the process, a layer of copper is first plated on the substrate, and then the final material, such as chromium and nickel, is plated on the copper layer.
What is the role of the potential difference in electroplating nickel plating?
In multi-layer nickel plating, there is a layer of high-sulfur nickel in the middle, and its potential is relatively active. When the corrosion medium exists, a micro-battery with this coating as the negative electrode and the upper and lower coatings as the positive electrode will be formed. However, this potential difference must be well controlled so that the corrosion current cannot be too large, otherwise the anti-corrosion effect will not be achieved.